HyperX 16GB (2x8GB) 2400MHz DDR4 Non-ECC CL15 1.2V Memory Stockists

.rpd-row { overflow: hidden; padding: 30px 0; border-bottom: 1px solid #eee; } .rpd-row h3 { font-size:22px; } .rpd-row img { max-width: 100%; } .rpd-left { float: left; width: 47.5%; padding-right: 2.5%; } .rpd-right { float: right; width: 50%; } .rpd-img { text-align:center; } Plug and play Get the speed you want, hassle free. HyperX FURY DDR4 is the first product line to offer automatic overclocking up to the highest frequency published. Optimised for Intel’s 200 Series and X99 chipsets HyperX FURY DDR4 memory is 100% tested and optimised for compatibility and easy overclocking. To complete a motherboard featuring 200 Series or X99 chipsets, you need the latest generation of DRAM technology – DDR4 memory. Low power consumption DDR4’s lower power requirements mean less heat and higher reliability. Low 1.2 volts draw less power from your system, which results in a cooler and quieter PC. Low-profile stylish heat spreader Stand out from the crowd and show your style with FURY’s asymmetrical signature heat spreader. Available in black, red and white with black PCB, FURY DDR4’s low profile heat spreader will fit under oversized CPU coolers while enhancing heat dissipation for lasting reliability. HyperX HX424C15FBK2/16 is a kit of two 1G x 64-bit (8GB) DDR4-2400 CL15 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 512M x 8-bit FBGA  components per Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Total kit capacity is 16GB. Each module has been tested to run at DDR4-2400 at a low latency timing of 15-15-15 at 1.2V. Specifications: - CL(IDD) 15 cycles - Row Cycle Time (tRCmin) 46.75ns(min.) - Refresh to Active/Refresh Command Time (tRFCmin) 260ns(min.) - Row Active Time (tRASmin) 29.125ns(min.) - UL Rating 94 V - 0 - Operating Temperature 0 oC to +85 oC - Storage Temperature -55 oC to +100 oC Features: - Power Supply: VDD = 1.2V Typical - VDDQ = 1.2V Typical - VPP - 2.5V Typical - VDDSPD = 2.2V to 3.6V - Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals - Low-power auto self refresh (LPASR) - Data bus inversion (DBI) for data bus - On-die VREFDQ generation and calibration - Dual-rank - On-board I2 serial presence-detect (SPD) EEPROM - 16 internal banks; 4 groups of 4 banks each - Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) - Selectable BC4 or BL8 on-the-fly (OTF) - Fly-by topology - Terminated control command and address bus - Height 1.340” (34.04mm), w/heatsink

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